Semiconductor device

ABSTRACT

A semiconductor device including a first fin pattern and a second fin pattern, which are in parallel in a lengthwise direction; a first trench between the first fin pattern and the second fin pattern; a field insulating film partially filling the first trench, an upper surface of the field insulating film being lower than an upper surface of the first fin pattern and an upper surface of the second fin pattern; a spacer spaced apart from the first fin pattern and the second fin pattern, the spacer being on the field insulating film and defining a second trench, the second trench including an upper portion and an lower portion; an insulating line pattern on a sidewall of the lower portion of the second trench; and a conductive pattern filling an upper portion of the second trench and being on the insulating line pattern.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a continuation application based on pending application Ser. No.15/390,762, filed Dec. 27, 2016, the entire contents of which is herebyincorporated by reference.

Korean Patent Application No. 10-2016-0007450, filed on Jan. 21, 2016,in the Korean Intellectual Property Office, and entitled: “SemiconductorDevice and Method for Fabricating the Same,” is incorporated byreference herein in its entirety.

BACKGROUND 1. Field

Embodiments relate to a semiconductor device and a method forfabricating the same.

2. Description of the Related Art

For semiconductor device density enhancement, the multigate transistorhas been suggested as one of the scaling technologies, according towhich a multi-channel active pattern (or silicon body) in a fin ornanowire shape is formed on a substrate, with gates then being formed ona surface of the multi-channel active pattern.

Such a multigate transistor allows easy scaling as it uses athree-dimensional channel. Further, current control capability can beenhanced without requiring increased gate length of the multigatetransistor. Furthermore, it is possible to effectively suppress shortchannel effect (SCE) which is the phenomenon that the electric potentialof the channel region is influenced by the drain voltage.

SUMMARY

The embodiments may be realized by providing a semiconductor deviceincluding a first fin pattern and a second fin pattern, which are inparallel in a lengthwise direction; a first trench between the first finpattern and the second fin pattern; a field insulating film partiallyfilling the first trench, an upper surface of the field insulating filmbeing lower than an upper surface of the first fin pattern and an uppersurface of the second fin pattern; a spacer spaced apart from the firstfin pattern and the second fin pattern, the spacer being on the fieldinsulating film and defining a second trench, the second trenchincluding an upper portion and an lower portion; an insulating linepattern on a sidewall of the lower portion of the second trench; and aconductive pattern filling an upper portion of the second trench andbeing on the insulating line pattern.

The embodiments may be realized by providing a semiconductor deviceincluding a first fin pattern having a long side and a short side; afield insulating film on a sidewall of the first fin pattern, an uppersurface of the field insulating film being lower than an upper surfaceof the first fin pattern; a spacer on the field insulating film, thespacer being spaced apart from the first fin pattern and defining atrench; an insulating line pattern extending along a portion of asidewall of the trench, on the spacer, an uppermost portion of theinsulating line pattern being equal to or higher than the upper surfaceof the first fin pattern; and a conductive pattern filling the trench onthe insulating line pattern.

The embodiments may be realized by providing a semiconductor deviceincluding a laterally adjacent first fin pattern and second fin patternon a substrate; a first trench between the laterally adjacent first finpattern and second fin pattern; a field insulating film partiallyfilling the first trench such that field insulating film is on asidewall of the first fin pattern and a sidewall of the second finpattern, a distance between an upper surface of the field insulatingfilm and the substrate being smaller than a distance between an uppersurface of the first fin pattern and the substrate and a distancebetween an upper surface of the second fin pattern and the substrate; aspacer completely spaced apart from the first fin pattern and the secondfin pattern, the spacer being on the field insulating film and defininga second trench such that the second trench includes an upper portionand an lower portion; an insulating line pattern on a sidewall of thelower portion of the second trench; and a conductive pattern filling anupper portion of the second trench and being on the insulating linepattern.

BRIEF DESCRIPTION OF THE DRAWINGS

Features will be apparent to those of skill in the art by describing indetail exemplary embodiments with reference to the attached drawings inwhich:

FIGS. 1 and 2 illustrate a layout diagram and a perspective view of asemiconductor device according to some exemplary embodiments;

FIG. 3 illustrates a partial perspective view of the fin-type patternand the field insulating film of FIG. 2;

FIGS. 4A and 4B illustrate cross sectional views taken on line A-A ofFIG. 2;

FIGS. 5A and 5B illustrate cross sectional views taken on line B-B ofFIG. 2;

FIG. 6 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIG. 7 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIG. 8 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIG. 9 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIG. 10 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIG. 11 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIG. 12 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIG. 13 illustrates an enlarged view of the area P of FIG. 12;

FIG. 14 illustrates a layout diagram of a semiconductor device accordingto some exemplary embodiments;

FIG. 15 illustrates a cross sectional view taken on line A-A of FIG. 14;

FIG. 16 illustrates a cross sectional view taken on line C-C of FIG. 14;

FIG. 17 illustrates a cross sectional view taken on line D-D of FIG. 14;

FIG. 18 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIG. 19 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIG. 20 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments;

FIGS. 21 to 33 illustrate sectional views of stages in an method offabrication of a semiconductor device according to some exemplaryembodiments;

FIG. 34 illustrates a sectional view of a stage of a method offabrication of a semiconductor device according to some exemplaryembodiments;

FIGS. 35 and 36 illustrate sectional views of stages in an method offabrication of a semiconductor device according to some exemplaryembodiments; and

FIG. 37 illustrates a block diagram of a system-on-chip (SoC) systemincluding a semiconductor device according to exemplary embodiments.

DETAILED DESCRIPTION

Hereinbelow, a semiconductor device according to a first exemplaryembodiment will be explained with reference to FIGS. 1 to 5B.

FIGS. 1 and 2 illustrate a layout diagram and a perspective view of asemiconductor device according to some exemplary embodiments. FIG. 3illustrates a partial perspective view of the fin-type pattern and thefield insulating film of FIG. 2. FIGS. 4A and 4B illustrate crosssectional views taken on line A-A of FIG. 2. FIGS. 5A and 5B illustratecross sectional views taken on line B-B of FIG. 2.

For reference, the fin-type patterns illustrated in FIGS. 1 to 3 includesource/drains formed on the fin-type (e.g., fin) patterns or in thefin-type patterns. Further, FIG. 2 briefly illustrates a fin-typepattern, a gate electrode, a conductive pattern, an insulating linepattern, and so on.

The drawings regarding a semiconductor device according to someexemplary embodiments exemplify a fin-type transistor (FinFET) includinga channel region in a fin-type pattern shape. In an implementation, asemiconductor device according to some exemplary embodiments may includea tunneling field-effect transistor (FET), a transistor comprisingnanowire, a transistor including nano-sheet, or a three-dimensional (3D)transistor. In an implementation, a semiconductor device according tosome exemplary embodiments may include a bipolar junction transistor, alaterally diffused metal oxide semiconductor (LDMOS) transistor, and soon.

Referring to FIGS. 1 to 5B, a semiconductor device according to someexemplary embodiments may include a first fin-type pattern (e.g., finpattern) 110, a second fin-type pattern 210, a first gate electrode 120,a second gate electrode 220, an insulating line pattern 160, and aconductive pattern 180.

A substrate 100 may be, e.g., a bulk silicon or a silicon-on-insulator(SOI). In an implementation, the substrate 100 may be a siliconsubstrate, or may include other material, e.g., silicon germanium,silicon germanium on insulator (SGOI), indium antimonide, leadtelluride, indium arsenide, indium phosphide, gallium arsenide, orgallium antimonide.

The first fin-type pattern 110 and the second fin-type pattern 210 maybe elongated or may extend in a first direction X. The first fin-typepattern 110 and the second fin-type pattern 210 may be formed inparallel in a lengthwise direction.

The first fin-type pattern 110 and the second fin-type pattern 210 mayextend in the first direction X, and the first fin-type pattern 110 andthe second fin-type pattern 210 may each include long sides 110 a and210 a along the first direction X, and short sides 110 b and 210 b alonga second direction Y.

For example, when the first fin-type pattern 110 and the second fin-typepattern 210 are formed in parallel in the lengthwise direction, it meansthat the short side 110 b of the first fin-type active pattern 110 isfacing the short side 210 b of the second fin-type pattern 210.

The long sides and the short sides may be distinguishable even when thefirst fin-type pattern 110 and the second fin-type pattern 210 haverounded corners.

The first fin-type pattern 110 and the second fin-type pattern 210 maybe adjacent to each other. The first fin-type pattern 110 and the secondfin-type pattern 210 in parallel in the lengthwise direction may beisolated by an isolating trench T.

The isolating trench T may be between the first fin-type pattern 110 andthe second fin-type pattern 210. For example, the isolating trench T maybe formed so as to be in contact with the short side 110 b of the firstfin-type pattern 110 and the short side 210 b of the second fin-typepattern 210. For example, the short side 110 b of the first fin-typepattern 110 and the short side 210 b of the second fin-type pattern 210may be defined by at least a portion of the isolating trench T.

The first fin-type pattern 110 and the second fin-type pattern 210 mayrefer to active patterns for use in the multigate transistor.Accordingly, the first fin-type pattern 110 and the second fin-typepattern 210 may be formed as the channels are connected with each otheralong three surfaces of the fin, or alternatively, the channels may beformed on two facing surfaces of the fin.

In the semiconductor device according to some exemplary embodiments, thefirst fin-type pattern 110 and the second fin-type pattern 210 may solocated as to be interposed by the isolating trench T therebetween.

In an implementation, the first fin-type pattern 110 may be formed onone side of the isolating trench T, and the second fin-type pattern 210may not be located on the other of the isolating trench T.

Hereinbelow, however, it is described that the first fin-type pattern110 and the second fin-type pattern 210 are located on both sides of theisolating trench T.

The first fin-type pattern 110 and the second fin-type pattern 210 maybe a portion of the substrate 100, and may include an epitaxial layergrown on the substrate 100.

The first fin-type pattern 110 and the second fin-type pattern 210 mayinclude an element semiconductor material, e.g., silicon or germanium.In an implementation, the first fin-type pattern 110 and the secondfin-type pattern 210 may include a compound semiconductor, e.g., a IV-IVgroup compound semiconductor or a III-V group compound semiconductor.

For example, with respect to the IV-IV group compound semiconductor, thefirst fin-type pattern 110 and the second fin-type pattern 210 may be abinary compound or a ternary compound including at least two or more ofcarbon (C), silicon (Si), germanium (Ge) and tin (Sn), or thesecompounds doped with IV group element.

With respect to the III-V group compound semiconductor, the firstfin-type pattern 110 and the second fin-type pattern 210 may be one of abinary compound, a ternary compound or a quaternary compound which isformed by a combination of a III group element which may be at least oneof aluminum (Al), gallium (Ga), or indium (In), with a V group elementwhich may be one of phosphorus (P), arsenic (As) and antimony (Sb).

In an implementation, in the semiconductor device, the first fin-typepattern 110 and the second fin-type pattern 210 may be silicon fin-typepatterns.

A field insulating film 105 may be formed on the substrate 100. Thefield insulating film 105 may be formed around the first fin-typepattern 110 and the second fin-type pattern 210. As such, the firstfin-type pattern 110 and the second fin-type pattern 210 may be definedby the field insulating film 105.

For example, the field insulating film 105 may be formed on a portion ofa sidewall of the first fin-type pattern 110 and on a portion of asidewall of the second fin-type pattern 210.

The field insulating film 105 may include a first region 106 and asecond region 107.

The first region 106 of the field insulating film may cover a sidewallincluding the long side 110 a of the first fin-type pattern 110 and asidewall including the long side 210 a of the second fin-type pattern210. The first region 106 of the field insulating film may be elongatedor extend in the first direction X, along the long side 110 a of thefirst fin-type pattern 110 and the long side 210 a of the secondfin-type pattern 210.

The second region 107 of the field insulating film may cover a sidewallincluding the short side 110 b of the first fin-type pattern 110 and asidewall including the short side 210 b of the second fin-type pattern210. The second region 107 of the field insulating film may be betweenthe short side 110 b of the first fin-type pattern 110 and the shortside 210 b of the second fin-type pattern 210.

The second region 107 of the field insulating film may partially fillthe isolating trench T between the first fin-type pattern 110 and thesecond fin-type pattern 210.

An upper surface of the field insulating film 105 may be lower than anupper surface of the first fin-type pattern 110 and an upper surface ofthe second fin-type pattern 210. For example, an upper surface of thefirst region 106 of the field insulating film and an upper surface ofthe second region 107 of the field insulating film may be lower than theupper surface of the first fin-type pattern 110 and the upper surface ofthe second fin-type pattern 210, respectively. For example, an uppersurface of the above-described elements may refer to a surface thatfaces away from the substrate 100.

For example, with reference to a bottom of the isolating trench T, aheight H1 of the first region 106 of the field insulating film and aheight H2 of the second region 107 of the field insulating film may beless than the height of the first fin-type pattern 110 and the height ofthe second fin-type pattern 210 (e.g., also with respect to the bottomof the isolating trench T), respectively.

The field insulating film 105 may partially cover the first fin-typepattern 110 and the second fin-type pattern 210. The first fin-typepattern 110 may include a lower portion 111 and an upper portion 112,and the second fin-type pattern 210 may include a lower portion 211 andan upper portion 212.

The field insulating film 105 may cover the lower portion 111 of thefirst fin-type pattern and the lower portion 211 of the second fin-typepattern. In an implementation, the field insulating film 105 may notcover the upper portion 112 of the first fin-type pattern nor the upperportion 212 of the second fin-type pattern. For example, the fieldinsulating film 105 may not be in contact with, nor may it be overlappedor laterally aligned with the upper portion 112 of the first fin-typepattern and the upper portion 212 of the second fin-type pattern.

For example, the upper portion 112 of the first fin-type pattern and theupper portion 212 of the second fin-type pattern may protrude upwardlyfurther than or outwardly relative to the upper surface of the firstregion 106 of the field insulating film and the upper surface of thesecond region 107 of the field insulating film 105, respectively.

The field insulating film 105 may include, e.g., an oxide film, anitride film, an oxynitride film, or a film combining the above.

A first spacer 130 may extend in the second direction Y and mayintersect the first fin-type pattern 110. The first spacer 130 maydefine a first trench 120 t.

The first trench 120 t may extend in the second direction Y and mayintersect the first fin-type pattern 110. The first trench 120 t mayexpose a portion of the first fin-type pattern 110.

A second spacer 230 may extend in the second direction Y and mayintersect the second fin-type pattern 210. The second spacer 230 maydefine a second trench 220 t.

The second trench 220 t may extend in the second direction Y and mayintersect the second fin-type pattern 110. The second trench 220 t mayexpose a portion of the second fin-type pattern 210.

The first liner 170 may extend in the second direction Y and may spanbetween the first fin-type pattern 110 and the second fin-type pattern210. The first liner 170 may be formed on the second region 107 of thefield insulating film 105. The first liner 170 may be spaced apart from,e.g., and not be in contact with, the first fin-type pattern 110 and thesecond fin-type pattern 210.

The first liner 170 may define a third trench 160 t. The third trench160 t may extend in the second direction Y, between the first trench 120t and the second trench 220 t. The third trench 160 t may be formedbetween the first fin-type pattern 110 and the second fin-type pattern210. The third trench 160 t may expose the upper surface of the secondregion 107 of the field insulating film.

The third trench 160 t may span between the short side 110 b of thefirst fin-type pattern 110 and the short side 210 b of the secondfin-type pattern 210. The third trench 160 t may be in parallel with theshort side 110 b of the first fin-type pattern 110 and the short side210 b of the second fin-type pattern 210, respectively.

The third trench 160 t may include an upper portion 160 ut and a lowerportion 160 bt. The manner in which the upper portion 160 ut of thethird trench and the lower portion 160 bt of the third trench aredistinguished from each other will be explained below, when explainingthe insulating line pattern 160 and the conductive pattern 180.

In the semiconductor device according to some exemplary embodiments, theupper portion 160 ut of the third trench and the lower portion 160 bt ofthe third trench may have substantially the same width as each other, atan area near a boundary between the upper portion 160 ut of the thirdtrench and the lower portion 160 bt of the third trench. For example, asidewall of the upper portion 160 ut of the third trench and a sidewallof the lower portion 161 bt of the third trench may be in the sameplane.

The first liner 170 may be in contact with the upper surface of thesecond region 107 of the field insulating film. A height of the firstliner 170 may be substantially the same as the thickness of aninterlayer insulating film 190 covering the second region 107 of thefield insulating film.

The first spacer 130, the second spacer 230, and the first liner 170 mayeach include at least one of, e.g., silicon nitride (SiN), siliconoxynitride (SiON), silicon dioxide (SiO₂), oxycarbonitride (SiOCN), or acombination thereof.

The interlayer insulating film 190 may be formed on the field insulatingfilm 105. The interlayer insulating film 190 may cover the firstfin-type pattern 110, the second fin-type pattern 210, and the fieldinsulating film 105.

The interlayer insulating film 190 may surround an outer sidewall of thefirst spacer 130 defining the first trench 120 t, an outer sidewall ofthe second spacer 230 defining the second trench 220 t, and an outersidewall of the first liner 170 defined the third trench 160 t.

The interlayer insulating film 190 may include, e.g., at least one ofsilicon oxide, silicon nitride, silicon oxynitride, and a low-kdielectric material. For example, the low-k dielectric material mayinclude flowable oxide (FOX), Tonen Silazene (TOSZ), undoped silicaglass (USG), borosilica glass (BSG), phosphosilica glass (PSG),borophosphosilica glass (BPSG), plasma enhanced tetra ethyl orthosilicate (PETEOS), fluoride silicate glass (FSG), carbon doped siliconoxide (CDO), xerogel, aerogel, amorphous fluorinated carbon, organosilicate glass (OSG), parylene, bis-benzocyclobutenes (BCB), SILK,polyimide, porous polymeric material, or a combination thereof.

The first gate electrode 120 may be formed so as to extend in the seconddirection Y and intersect the first fin-type pattern 110. The first gateelectrode 120 may be formed in the first trench 120 t.

The first gate electrode 120 may be formed on the first fin-type pattern110 and the field insulating film 105. The first gate electrode 120 maysurround the first fin-type pattern 110 protruding upwardly further thanthe upper surface of the field insulating film 105, e.g., may surroundthe upper portion 112 of the first fin-type pattern.

The second gate electrode 220 may be formed so as to extend in thesecond direction Y and may intersect the second fin-type pattern 210.The second gate electrode 220 may be formed in the second trench 220 t.

The second gate electrode 220 may be formed on the second fin-typepattern 210 and the field insulating film 105. The second gate electrode220 may surround the second fin-type pattern 210 protruding upwardlyfurther than the upper surface of the field insulating film 105, e.g.,may surround the upper portion 212 of the second fin-type pattern.

The first gate electrode 120 and the second gate electrode 220 may eachinclude at least one of, e.g., titanium nitride (TiN), tantalum carbide(TaC), tantalum nitride (TaN), titanium silicon nitride (TiSiN),tantalum silicon nitride (TaSiN), tantalum titanium nitride (TaTiN),titanium aluminum nitride (TiAlN), tantalum aluminum nitride (TaAlN),tungsten nitride (WN), ruthenium (Ru), titanium aluminum (TiAl),titanium aluminum carbonitride (TiAlC—N), titanium aluminum carbide(TiAlC), titanium carbide (TiC), tantalum carbonitride (TaCN), tungsten(W), aluminum (Al), copper (Cu), cobalt (Co), titanium (Ti), tantalum(Ta), nickel (Ni), platinum (Pt), nickel platinum (Ni—Pt), niobium (Nb),niobium nitride (NbN), niobium carbide (NbC), molybdenum (Mo),molybdenum nitride (MoN), molybdenum carbide (MoC), tungsten carbide(WC), rhodium (Rh), palladium (Pd), iridium (Ir), osmium (Os), silver(Ag), gold (Au), zinc (Zn), vanadium (V), or a combination thereof.

The first gate electrode 120 and the second gate electrode 220 may eachinclude, e.g., a conductive metal oxide, a conductive metal oxynitride,or the like, and an oxidized form of the materials described above.

For example, the first gate electrode 120 and the second gate electrode220 may be formed by replacement process (or gate last process).

The insulating line pattern 160 may be formed on the second region 107of the field insulating film. The insulating line pattern 160 may extendin the second direction Y.

The insulating line pattern 160 may be formed on the first liner 170,e.g., on the sidewall of the first liner 170. The insulating linepattern 160 may be formed in a portion of the third trench 106 t thatexposes the upper surface of the second region 107 of the fieldinsulating film.

In an implementation, the insulating line pattern 160 may be formed onthe sidewall and a bottom surface of the lower portion 160 bt of thethird trench.

The insulating line pattern 160 may include a first portion 160 aextending along the sidewall of the lower portion 160 bt of the thirdtrench, and a second portion 160 b extending along the bottom surface ofthe lower portion 160 bt of the third trench.

The first portion 160 a of the insulating line pattern may be formedalong a portion of the sidewall of the third trench 160 t. The firstportion 160 a of the insulating line pattern may extend along thesidewall of the lower portion 160 bt of the third trench, and may notextended along the sidewall of the upper portion 160 ut of the thirdtrench.

The third trench 160 t may include a first sidewall and a secondsidewall facing each other. The first sidewall of the third trench 160 tmay be adjacent to the short side 110 b of the first fin-type pattern110, and the second sidewall of the third trench 106 t may be adjacentto the short side 210 b of the second fin-type pattern 210.

The first portion 160 a of the insulating line pattern may include aportion formed on the first sidewall of the third trench 160 t, and aportion formed on the second sidewall of the third trench 160 t adjacentto the short side 210 b of the second fin-type pattern 210.

At this time, the first portion 160 a of the insulating line patternformed on the first sidewall of the third trench 160 t may be spacedapart from the first portion 160 a of the insulating line pattern formedon the second sidewall of the third trench 160 t.

An uppermost portion of the insulating line pattern 160 may be lowerthan the upper surface of the first gate electrode 120 and the uppersurface of the second gate electrode 220.

As illustrated in FIG. 4A, the uppermost portion of the insulating linepattern 160 may be positioned at a same height as the upper surface ofthe first fin-type pattern 110 and the upper surface of the secondfin-type pattern 210. In an implementation, as illustrated in FIG. 4B,the uppermost portion of the insulating line pattern 160 may be higherthan the upper surface of the first fin-type pattern 110 and the uppersurface of the second fin-type pattern 210.

The height from the substrate 100 to the uppermost portion of theinsulating line pattern 160 may be H2+H4, and the height from thesubstrate 100 to the upper surface of the first fin-type pattern 110 maybe H2+H5. In an implementation, the height (H2+H4) from the substrate100 to the uppermost portion of the insulating line pattern 160 may begreater than or equal to the height (H2+H5) from the substrate 100 tothe upper surface of the first fin-type pattern 110.

For example, the height H4 of the uppermost portion of the insulatingline pattern 160 may be greater than or equal to the height 145 of theupper portion 112 of the first fin-type pattern and the height H15 ofthe upper portion 212 of the second fin-type pattern, which areprotruded upwardly further than the upper surface of the second region107 of the field insulating film.

A bottom surface of the insulating line pattern 160, e.g., the secondportion 160 b of the insulating line pattern, may be lower than theupper surface of the first fin-type pattern 110 and the upper surface ofthe second fin-type pattern 210. For example, the second portion 160 bof the insulating line pattern may be closer to the bottom of theisolating trench T than the upper surface of the first fin-type pattern110 and the upper surface of the second fin-type pattern 210.

The insulating line pattern 160 may span between the first fin-typepattern 110 and the second fin-type pattern 210. The insulating linepattern 160 may be formed between the first fin-type pattern 110 and thesecond fin-type pattern 210. For example, the insulating line pattern160 may span between the short side 110 b of the first fin-type pattern110 and the short side 210 b of the second fin-type pattern 210.

The insulating line pattern 160 may be formed so as to span or bebetween the first fin-type pattern 110 and the second fin-type pattern210, in which case the insulating line pattern 160 may not be in contactwith the first fin-type pattern 110 and the second fin-type pattern 210.

The first liner 170 and the interlayer insulating film 190 may beinterposed between the insulating line pattern 160 and the firstfin-type pattern 110, and between the insulating line pattern 160 andthe second fin-type pattern 210.

The insulating line pattern 160 may include an insulation material. Theinsulating line pattern 160 may not include a conductive material. Forexample, the insulating line pattern 160 may include at least one ofsilicon oxide, silicon nitride, silicon oxynitride, siliconcarbonitride, or silicon oxycarbonitride.

A second liner 175 may be formed along the sidewall and the bottomsurface of the third trench 160 t. For example, the second liner 175 maybe formed along the sidewall and the bottom surface of the lower portion160 bt of the third trench. For example, the second liner 175 may extendalong a portion of the sidewall of the third trench 160 t and along thebottom surface of the third trench 160 t.

The second liner 175 may be formed between the insulating line pattern160 and the first liner 170, and between the insulating line pattern 160and the second region 107 of the field insulating film.

The second liner 175 may include a first portion extending along thebottom surface of the third trench 160 t, and a second portion extendingalong the sidewall of the third trench 160 t.

The first portion of the second liner 175 may extend along the uppersurface of the second region 107 of the field insulating film, betweenthe insulating line pattern 160 and the second region 107 of the fieldinsulating film. The first portion of the second liner 175 may be formedalong the second portion 160 b of the insulating line pattern.

Between the insulating line pattern 160 and the first liner 170, thesecond portion of the second liner 175 may extend along the innersidewall of the first liner 170. The second portion of the second liner175 may be formed along the first portion 160 a of the insulating linepattern.

For example, the insulating line pattern 160 may be formed along aprofile of the second liner 175 on the sidewall and bottom surface ofthird trench 160 t.

The uppermost portion of the second liner 175 may be lower than theupper surface of the first gate electrode 120 and the upper surface ofthe second gate electrode 220. Further, the uppermost portion of thesecond liner 175 may be higher than or equal to the upper surface of thefirst fin-type pattern 110 and the upper surface of the second fin-typepattern 210.

In an implementation, as illustrated in FIGS. 4A and 4B, the uppermostportion of the second liner 175 and the uppermost portion of theinsulating line pattern 160 may be positioned at the same height.

In an implementation, as illustrated in FIGS. 4A and 4B, an uppermostsurface of the second liner 175 and an uppermost surface of theinsulating line pattern 160 may be in parallel with the upper surface ofthe conductive pattern 180. In an implementation, the uppermost surfaceof the second liner 175 and the uppermost surface of the insulating linepattern 160 may have a slope to the upper surface of the conductivepattern 180.

The second liner 175 may include a material having an etch selectivityto a material included in the first liner 170. In an implementation, thesecond liner 175 may include a material having an etch selectivity to amaterial included in the insulating line pattern 160.

For example, the second liner 175 may include at least one of siliconoxide, silicon nitride, silicon oxynitride, silicon carbonitride, orsilicon oxycarbonitride.

The conductive pattern 180 may be formed on the insulating line pattern160 and the second liner 175. The conductive pattern 180 may extend inthe second direction Y.

The conductive pattern 180 may be formed by partially filling the thirdtrench 160 t. For example, the conductive pattern 180 may be formed byfilling the upper portion 160 ut of the third trench.

The conductive pattern 180 may span or be between the first fin-typepattern 110 and the second fin-type pattern 210. The conductive pattern180 may be formed between the first fin-type pattern 110 and the secondfin-type pattern 210.

The uppermost portion of the insulating line pattern 160 and theuppermost portion of the second liner 175 may be higher than or equal tothe upper surface of the first fin-type pattern 110 and the uppersurface of the second fin-type pattern 210, and the conductive pattern180 on the insulating line pattern 160 and the second liner 175 may notbe in contact with, e.g., may be completely spaced apart from, the firstfin-type pattern 110 and the second fin-type pattern 210.

The upper surface of the conductive pattern 180 may be in the same planeas the upper surface of the first gate electrode 120 and the uppersurface of the second gate electrode 220. The upper surface of theconductive pattern 180 may be in the same plane as the upper surface ofthe interlayer insulating film 190.

As illustrated, the conductive pattern 180 may be formed on theinsulating line pattern 160 and the second liner 175, although a portionof the conductive pattern 180 may be formed, extending between theinsulating line patterns 160.

For example, a portion of the conductive pattern 180 may be interposedbetween the first portions 160 a of the insulating line pattern. Theportion of the conductive pattern 180 may fill the lower portion 160 btof the third trench.

The conductive pattern 180 may include, e.g., titanium nitride (TiN),tantalum carbide (TaC), tantalum nitride (TaN), titanium silicon nitride(TiSiN), tantalum silicon nitride (TaSiN), tantalum titanium nitride(TaTiN), titanium aluminum nitride (TiAlN), tantalum aluminum nitride(TaAlN), tungsten nitride (WN), ruthenium (Ru), titanium aluminum(TiAl), titanium aluminum carbonitride (TiAlC—N), titanium aluminumcarbide (TiAlC), titanium carbide (TiC), tantalum carbonitride (TaCN),tungsten (W), aluminum (Al), copper (Cu), cobalt (Co), titanium (Ti),tantalum (Ta), nickel (Ni), platinum (Pt), nickel platinum (Ni—Pt),niobium (Nb), niobium nitride (NbN), niobium carbide (NbC), molybdenum(Mo), molybdenum nitride (MoN), molybdenum carbide (MoC), tungstencarbide (WC), rhodium (Rh), palladium (Pd), iridium (Ir), osmium (Os),silver (Ag), gold (Au), zinc (Zn), vanadium (V), or a combinationthereof.

In an implementation, the conductive pattern 180 may each includeconductive metal oxide, conductive metal oxynitride or the like, or anoxidized form of the aforementioned material.

A first gate insulating film 125 may be formed between the firstfin-type pattern 110 and the first gate electrode 120. The first gateinsulating film 125 may be formed along a profile of the first fin-typepattern 110 protruding upward further than the field insulating film105.

In an implementation, the first gate insulating film 125 may be disposedbetween the first gate electrode 120 and the field insulating film 105.The first gate insulating film 125 may be formed along the sidewall andthe bottom surface of the first trench 120 t.

A second gate insulating film 225 may be formed between the secondfin-type pattern 210 and the second gate electrode 220. The second gateinsulating film 225 may be formed along a profile of the second fin-typepattern 210 protruding upwardly further than the field insulating film105.

In an implementation, the second gate insulating film 225 may be betweenthe second gate electrode 220 and the field insulating film 105. Thesecond gate insulating film 225 may be formed along the sidewall and thebottom surface of the second trench 220 t.

In an implementation, unlike the illustration in FIG. 5A, in FIG. 5B, aninterfacial layer 121 may be additionally formed between the first gateinsulating film 125 and the first fin-type pattern 110. An interfaciallayer may be additionally formed between the second gate insulating film225 and the second fin-type pattern 210.

In an implementation, the interfacial layer may be additionally formedbetween the first gate insulating film 125 and the first fin-typepattern 110, and also between the second gate insulating film 225 andthe second fin-type pattern 210.

In an implementation, as illustrated in FIG. 5B, the interfacial layer121 may be formed along the profile of the first fin-type pattern 110which protrudes greater than or from the upper surface of the fieldinsulating film 105.

The interfacial layer 121 may extend along the upper surface of thefield insulating film 105 depending on methods for forming theinterfacial layer 121.

The first gate insulating film 125 and the second gate insulating film225 may each include, e.g., silicon oxide, silicon oxynitride, siliconnitride and a high-k dielectric material with a higher dielectricconstant than silicon oxide. For example, the high-k dielectric materialmay include one or more of hafnium oxide, hafnium silicon oxide, hafniumaluminum oxide, lanthanum oxide, lanthanum aluminum oxide, zirconiumoxide, zirconium silicon oxide, tantalum oxide, titanium oxide, bariumstrontium titanium oxide, barium titanium oxide, strontium titaniumoxide, yttrium oxide, aluminum oxide, lead scandium tantalum oxide, orlead zinc niobate.

In an implementation, the high-k dielectric material described above maybe an oxide or, alternatively, the high-k dielectric material mayinclude one or more of a nitride (e.g., hafnium nitride) and/oroxynitride (e.g., hafnium oxynitride) of the metal materials (e.g.,hafnium) described above.

A conductive pattern liner 185 may be formed between the conductivepattern 180 and the insulating line pattern 160, and between theconductive pattern 180 and the first liner 170. The conductive patternliner 185 may be formed along the inner sidewall of the first liner 170,and along the insulating line pattern 160.

The conductive pattern liner 185 may be formed along the sidewall andthe bottom surface of the third trench 160 t in which the second liner175 and the insulating line pattern 160 are formed.

The conductive pattern liner 185 may be formed on the second liner 175and the insulating line pattern 160. The conductive pattern liner 185may cover the uppermost surface of the second liner 175 and theuppermost surface of the insulating line pattern 160, respectively. Theconductive pattern 180 may be formed on the conductive pattern liner185.

The conductive pattern liner 185 may include, e.g., high-k dielectricinsulating film. The description of the high-k dielectric insulatingfilm may be the same as above.

In an implementation, as illustrated in FIGS. 4A and 4B, the conductivepattern 180 may fill the lower portion 160 bt of the third trench inwhich the conductive pattern liner 185 is formed.

If the lower portion 160 bt of the third trench in which the insulatingline pattern 160 is formed is entirely filled by the conductive patternliner 185, a portion of the conductive pattern 180 may not be interposedbetween the first portions 160 a of the insulating line patterns.

A first source/drain 140 may be formed on both sides of the first gateelectrode 120. The first source/drain 140 may be formed between thefirst gate electrode 120 and the insulating line pattern 160.

The first source/drain 140 may be formed by doping impurity in the upperportion 112 of the first fin-type pattern.

A second source/drain 240 may be formed on both sides of the second gateelectrode 220. The second source/drain 240 may be formed between thesecond gate electrode 220 and the insulating line pattern 160.

The second source/drain 240 may be formed by doping impurity in theupper portion 212 of the second fin-type pattern.

The first source/drain 140 and the second source/drain 240 may not be incontact with, e.g., may each be completely spaced apart from, the firstliners 170.

In drawings for exemplary embodiments to be described below, theuppermost portion of the insulating line pattern 160 is illustrated asbeing positioned at the same height as the upper surface of the firstfin-type pattern 110 and the upper surface of the second fin-typepattern 210.

FIG. 6 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments. For convenience of explanation,differences that are not explained above with reference to FIGS. 1 to 5Bwill be mainly explained below.

Referring to FIG. 6, in the semiconductor device according to someexemplary embodiments, the first source/drain 140 may include a firstepitaxial layer 145 on the first fin-type pattern 110, and the secondsource/drain 240 may include a second epitaxial layer 245 on the secondfin-type pattern 210.

The first epitaxial layer 145 may be formed so as to fill a recessformed on the upper portion 112 of the first fin-type pattern. Thesecond epitaxial layer 245 may be formed so as to fill a recess formedon the upper portion 212 of the second fin-type pattern.

In an implementation, as illustrated in FIG. 6, the first epitaxiallayer 145 on an end of the first fin-type pattern 110 and the secondepitaxial layer 245 on an end of the second fin-type pattern 210 mayeach include facets 145 f and 245 f.

When the semiconductor device according to some exemplary embodiments isa PMOS transistor, the first epitaxial layer 145 and the secondepitaxial layer 245 may include a compressive stress material. Forexample, the compressive stress material may be a material such as SiGethat has a higher lattice constant than Si. For example, the compressivestress material may enhance mobility of the carrier in the channelregion by exerting compressive stress on the first fin-type pattern 110and the second fin-type pattern 210.

In an implementation, when the semiconductor device is an NMOStransistor, the first epitaxial layer 145 and the second epitaxial layer245 may include a tensile stress material. For example, when the firstfin-type pattern 110 and the second fin-type pattern 210 are silicon(Si), the first epitaxial layer 145 and the second epitaxial layer 245may be a material such as SiC that has a smaller lattice constant thanthe Si. For example, the tensile stress material can enhance mobility ofthe carrier in the channel region by exerting tensile stress on thefirst fin-type pattern 110 and the second fin-type pattern 210.

In an implementation, when the first fin-type pattern 110 and the secondfin-type pattern 210 are Si, the first epitaxial layer 145 and thesecond epitaxial layer 245 may be a silicon epitaxial pattern,respectively.

It is thus possible that when the first gate electrode 120 and thesecond gate electrode 220 are included in different types of MOStransistors, the first epitaxial layer 145 and the second epitaxiallayer 245 may include different materials from each other.

FIG. 7 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments. FIG. 8 illustrates a sectional view of asemiconductor device according to some exemplary embodiments. FIG. 9illustrates a sectional view of a semiconductor device according to someexemplary embodiments. For convenience of explanation, differences thatare not explained above with reference to FIGS. 1 to 5B will be mainlyexplained below.

Referring to FIG. 7, the semiconductor device according to someexemplary embodiments may additionally include an air gap 155 betweenthe conductive pattern 180 and the conductive pattern liner 185, e.g.,between a portion of the conductive pattern 180 and the conductivepattern liner 185.

The conductive pattern liner 185 may extend along the first liner 170and the insulating line pattern 160.

The conductive pattern 180 may not fill the lower portion 160 bt of thethird trench in which the conductive pattern liner 185 is formed. Due toreduced step coverage of process for forming the conductive pattern 180or the process margin, the conductive pattern 180 may not fill the lowerportion 160 bt of the third trench.

As a result, the air gap 155 may be formed between the conductivepattern 180 and the conductive pattern liner 185.

Referring to FIG. 8, the semiconductor device according to someexemplary embodiments may additionally include an air gap 155 betweenthe conductive pattern liner 185 and the insulating line pattern 160,e.g., between a portion of the conductive pattern liner 185 and theinsulating line pattern 160.

The conductive pattern liner 185 may not be formed along the sidewalland the bottom surface of the lower portion 162 t of the third trench inwhich the insulating line pattern 160 is formed. Due to reduced stepcoverage of process for forming the conductive pattern liner 185 or theprocess margin, the conductive pattern liner 185 may not be formed alonga profile of the insulating line pattern 160.

As a result, the air gap 155 may be formed between the conductivepattern liner 185 and the insulating conductive pattern 160.

Referring to FIG. 9, in the semiconductor device according to someexemplary embodiments, the conductive pattern 180 may include an air gap155 therein.

The conductive pattern liner 185 may extend along the first liner 170and the insulating line pattern 160. Further, a portion of theconductive pattern 180 may fill the lower portion 160 bt of the thirdtrench.

However, during formation of the conductive pattern 180, an overhang maybe formed near the uppermost portion of the insulating line pattern 160,and the conductive pattern 180 may not entirely fill the lower portion160 bt of the third trench. This is because the step coverage of processfor forming the conductive pattern 180 may be reduced.

Accordingly, the air gap 155 may be formed within the conductive pattern180.

FIG. 10 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments. For convenience of explanation,differences that are not explained above with reference to FIGS. 1 to 5Bwill be mainly explained below.

Referring to FIG. 10, in the semiconductor device according to someexemplary embodiments, the insulating line pattern 160 may be formed onthe sidewall of the lower portion 160 bt of the third trench, and maynot be formed on the bottom surface of the lower portion 160 bt of thethird trench.

For example, the insulating line pattern 160 may include a first portion160 a of the insulating line pattern extending along the sidewall of thelower portion 160 bt of the third trench. The insulating line pattern160 may not include a second portion 160 b (FIG. 4) of the insulatingline pattern extending along the bottom surface of the lower portion 160bt of the third trench.

FIG. 11 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments. For convenience of explanation,differences that are not explained above with reference to FIGS. 1 to 5Bwill be mainly explained below.

Referring to FIG. 11, in the semiconductor device according to someexemplary embodiments, the conductive pattern liner 185 on the bottomsurface of the lower portion 160 bt of the third trench may be incontact with the field insulating film 105.

The second liner 175 may be formed on the sidewall of the lower portion160 bt of the third trench, and may not be formed on a portion of thebottom surface of the lower portion 160 bt of the third trench.

The second liner 175 on the sidewall of the third trench 160 t facingeach other may include a portion extending on the sidewall of the thirdtrench 160 t and a portion formed on the bottom surface of the thirdtrench 160 t, respectively. The second liner 175 formed on the secondregion 107 of the field insulating film may have, e.g., an L-shape.

The insulating line pattern 160 may be formed on the second liner 175 onthe sidewall of the third trench 160 t facing each other. The insulatingline pattern 160 may include a first portion 160 a of the insulatingline pattern extending along the sidewall of the lower portion 160 bt ofthe third trench. The insulating line pattern 160 may not include asecond portion 160 b (FIG. 4) of the insulating line pattern extendingalong the bottom surface of the lower portion 160 bt of the thirdtrench.

FIG. 12 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments. FIG. 13 illustrates an enlarged view ofthe area P of FIG. 12. For convenience of explanation, differences thatare not explained above with reference to FIGS. 1 to 5B will be mainlyexplained below.

Referring to FIGS. 12 and 13, in the semiconductor device according tosome exemplary embodiments, the second liner 175 may include a firstfilm 175 a, a second film 175 b, and a third 175 c stacked in asequential order on the second region 107 of the field insulating film.

The first film 175 a may be formed along a sidewall and a bottom surfaceof the third trench 160 t. The first film 175 a may be formed along theupper surface of the field insulating film 105 and along a sidewall ofthe first liner 170.

The second film 175 b may be formed along a sidewall and a bottomsurface of the third trench 160 t in which the first film 175 a isformed, and the third film 175 c may be formed along a sidewall and abottom surface of the third trench 160 t in which the second film 175 bis formed.

FIG. 13 illustrates the second liner 175 including three layers stackedon the first liner 170 in a sequential order.

The second film 175 b may include a material having an etch selectivityto a material included in the first film 175 a. In an implementation,the second film 175 b may include a material having an etch selectivityto a material included in the third film 175 c.

For example, the first film 175 a and the third film 175 c may includeat least one of silicon oxide, silicon nitride, silicon oxynitride,silicon carbonitride, or silicon oxycarbonitride, respectively. In animplementation, second film 175 b may include, e.g., silicon, silicongermanium, or germanium.

FIG. 14 illustrates a layout diagram of a semiconductor device accordingto some exemplary embodiments. FIG. 15 illustrates a cross sectionalview taken on line A-A of FIG. 14. FIG. 16 illustrates a cross sectionalview taken on line C-C of FIG. 14. FIG. 17 illustrates a cross sectionalview taken on line D-D of FIG. 14.

For convenience of explanation, differences that are not explained abovewith reference to FIGS. 1 to 5B will be mainly explained below.

In an implementation, the cross sectional view taken on line A-A of FIG.14 may be illustrated in a similar manner as FIG. 4. Accordingly, thecross sectional view taken on line A-A of FIG. 14 may be illustrated ina similar manner as FIG. 6.

Referring to FIGS. 14 to 17, a semiconductor device according to someexemplary embodiments may include, e.g., a first fin-type pattern 110, asecond fin-type pattern 210, a third fin-type pattern 310, a fourthfin-type pattern 410, a first gate electrode 120, a second gateelectrode 220, and a connect gate pattern 350.

The third fin-type pattern 310 may be elongated or extend in a firstdirection X. The first fin-type pattern 110 and the third fin-typepattern 310 may be elongated or extend in the first direction X, and thefirst fin-type pattern 110 and the third fin-type pattern 310 may bearranged in (e.g., spaced apart along) a second direction Y. In animplementation, the second fin-type pattern 210 and the third fin-typepattern 310 may be arranged in (e.g., spaced apart along) the seconddirection Y.

For example, the long side 110 a of the first fin-type pattern 110 andthe long side 310 a of the third fin-type pattern 310 may be facing eachother, and the long side 210 a of the second fin-type pattern 210 andthe long side 310 a of the third fin-type pattern 310 may be facing eachother.

The fourth fin-type pattern 410 may be elongated in the first directionX. The fourth fin-type pattern 410 may be formed in parallel with thethird fin-type pattern 310. The third fin-type pattern 310 and thefourth fin-type pattern 410 may be arranged in (e.g., spaced apartalong) the second direction Y.

Between the third fin-type pattern 310 and the fourth fin-type pattern410, the first fin-type pattern 110 and the second fin-type pattern 210may be disposed. The first fin-type pattern 110 and the second fin-typepattern 210 may be aligned longitudinally or laterally in the firstdirection X, between the third fin-type pattern 310 and the fourthfin-type pattern 410.

For example, the long side 110 a of the first fin-type pattern 110 andthe long side 410 a of the fourth fin-type pattern 410 may be facingeach other, and the long side 210 a of the second fin-type pattern 210and the long side 410 a of the fourth fin-type pattern 410 may be facingeach other.

The first to fourth fin-type patterns 110, 210, 310 and 410 may extendin the first direction X, respectively. The first fin-type pattern 110,the third fin-type pattern 310, and the fourth fin-type pattern 410 maybe arranged in the second direction Y, and the second fin-type pattern210, the third fin-type pattern 310, and the fourth fin-type pattern 410may be arranged in the second direction Y.

The field insulating film 105 may be formed around the third fin-typepattern 310 and the fourth fin-type pattern 410. The field insulatingfilm 105 may partially cover the third fin-type pattern 310 and thefourth fin-type pattern 410. The third fin-type pattern 310 and thefourth fin-type pattern 410 may be defined by the field insulating film105.

The upper surface of the field insulating film 105 in contact with thelong side 310 a of the third fin-type pattern 310 and the long side 410a of the fourth fin-type pattern 410 may be lower than the upper surfaceof the third fin-type pattern 310 and the upper surface of the fourthfin-type pattern 410.

Repeated descriptions of the third fin-type pattern 310 and the fourthfin-type pattern 410 may be omitted below, but may be understood basedon the description provided above about the first fin-type pattern 110and the second fin-type pattern 210.

FIG. 14 illustrates that one of the fin-type patterns, viz., the firstfin-type pattern 110 or the second fin-type pattern 210, may be locatedbetween the third fin-type pattern 310 and the fourth fin-type pattern410.

The connect gate pattern 350 may be elongated in the second direction Y.The connect gate pattern 350 may be formed in the third trench 160 t.

The connect gate pattern 350 may be formed on the third fin-type pattern310, the fourth fin-type pattern 410, and the field insulating film 105.However, the connect gate pattern 350 may not be formed on the firstfin-type pattern 110 and the second fin-type pattern 210.

The connect gate pattern 350 may be formed so as to intersect the thirdfin-type pattern 310 and the fourth fin-type pattern 410. However, theconnect gate pattern 350 may not intersect the first fin-type pattern110 and the second fin-type pattern 210.

The connect gate pattern 350 may be formed so as to span between thefirst fin-type pattern 110 and the second fin-type pattern 210. That is,the connect gate pattern 350 may span between the short side 110 b ofthe first fin-type pattern 110 and the short side 210 b of the secondfin-type pattern 210.

Accordingly, the third fin-type pattern 310 and the fourth fin-typepattern 410 may be the neighboring fin-type patterns which areintersected by the connect gate pattern 350. That is, with reference tothe connect gate pattern 350, there may not be any fin-type patternsprotruding upward further than the upper surface of the field insulatingfilm 105 between the third fin-type pattern 310 and the fourth fin-typepattern 410.

The connect gate pattern 350 may include the third gate electrode 320,the fourth gate electrode 420, and a connect pattern 165. The connectpattern 165 may be disposed between the third gate electrode 320 and thefourth gate electrode 420.

The connect pattern 165 may connect the third gate electrode 320 and thefourth gate electrode 420. The connect pattern 165 may be in contactwith the third gate electrode 320 and the fourth gate electrode 420.

The connect pattern 165 may include an insulating line pattern 160 onthe field insulating film 105 between the first fin-type pattern 110 andthe second fin-type pattern 210, and a conductive pattern 180 on theinsulating line pattern 160. For example, the conductive pattern 180 maydirectly connect the third gate electrode 320 and the fourth gateelectrode 420.

The third gate electrode 320 may intersect the third fin-type pattern310. The fourth gate electrode 420 may intersect the fourth fin-typepattern 410.

The third gate electrode 320 and the fourth gate electrode 420 may notpass through between the first fin-type pattern 110 and the secondfin-type pattern 210. For example, the third gate electrode 320 and thefourth gate electrode 420 may not pass or be present between the shortside 110 b of the first fin-type pattern 110 and the short side 210 b ofthe second fin-type pattern 210.

The connect pattern 165 may not be formed on the third fin-type pattern310 and the fourth fin-type pattern 410. The connect pattern 165 may notintersect the third fin-type pattern 310 and the fourth fin-type pattern410, respectively.

The connect pattern 165 may not be in contact with (e.g., may becompletely spaced apart from) the first fin-type pattern 110 and thesecond fin-type pattern 210. For example, the insulating line pattern160 and the conductive pattern 180 may not be in contact with the firstfin-type pattern 110 and the second fin-type pattern 210, respectively.

The connect gate pattern 350, i.e., the third gate electrode 320, thefourth gate electrode 420, and the connect pattern 165, may be formed inthe third trench 160 t. The third trench 160 t may include a firstportion 161 t, a second portion 162 t, and a third portion 163 t.

The first portion 161 t of the third trench may include a portionlocated between the short side 110 b of the first fin-type pattern 110and the short side 210 b of the second fin-type pattern 210. The secondportion 162 t of the third trench may intersect the third fin-typepattern 310 to expose a portion of the third fin-type pattern 310. Thethird portion 163 t of the third trench may intersect the fourthfin-type pattern 410 to expose a portion of the fourth fin-type pattern410.

In this case, the connect pattern 165 may be formed by filling the firstportion 161 t of the third trench, the third gate electrode 320 may beformed by filling the second portion 162 t of the third trench, and thefourth gate electrode 420 may be formed by filling the third portion 163t of the third trench.

A portion in which the insulating line pattern 160 included in theconnect pattern 165 is formed may be defined as a first portion 161 t ofthe third trench. In an implementation, with reference to the insulatingline pattern 160 included in the connect pattern 165, a portionintersecting the third fin-type pattern 310 may be defined as a secondportion 162 t of the third trench, and a portion intersecting with thefourth fin-type pattern 410 may be defined a third portion 163 t of thethird trench.

The insulating line pattern 160 may be formed on the field insulatingfilm 105 located between the third fin-type pattern 310 and the fourthfin-type pattern 410.

The insulating line pattern 160 may include a first portion 160 a of theinsulating line pattern protruded from the upper surface of the fieldinsulating film 105, and a second portion 160 b of the insulating linepattern extending along the upper surface of the field insulating film105.

In an implementation, as illustrated in FIG. 17, the first portion 160 aof the insulating line pattern may be a pair of protruding insulatingpatterns protruding from the upper surface of the field insulating film105. In an implementation, the second portion 160 b of the insulatingline pattern may be an extending insulating pattern extending along theupper surface of the field insulating film 105. The pair of theprotruding insulating patterns may be connected by the extendinginsulating pattern.

The second liner 175 may be located between the insulating line pattern160 and the field insulating film 105. The second liner 175 may extendalong the upper surface of the field insulating film 105.

In an implementation, as illustrated in FIG. 17, the second liner 175may not include a portion protruding from the upper surface of the fieldinsulating film 105.

The conductive pattern 180 may be formed on the insulating line pattern160. The conductive pattern 180 may also be formed between firstportions 160 a of the pair of the insulating line patterns protrudingfrom the upper surface of the field insulating film 105.

A height from the upper surface of the field insulating film 105 to theupper surface of the conductive pattern 180 may be greater than a heightfrom the upper surface of the field insulating film 105 to the uppermostportion of the first portion 160 a of the insulating line pattern.

The third gate electrode 320 may be formed so as to extend in the seconddirection Y and intersect the third fin-type pattern 310. The third gateelectrode 320 may be formed on the third fin-type pattern 310 and thefield insulating film 105.

The third gate electrode 320 may surround the third fin-type pattern 310protruding upward further than the upper surface of the field insulatingfilm 105, i.e., may surround the upper portion 312 of the third fin-typepattern.

The fourth gate electrode 420 may be formed so as to extend in thesecond direction Y and intersect the fourth fin-type pattern 410. Thefourth gate electrode 420 may be formed on the fourth fin-type pattern410 and the field insulating film 105.

The fourth gate electrode 420 may surround the fourth fin-type pattern410 protruding upward further than the upper surface of the fieldinsulating film 105, i.e., may surround the upper portion 412 of thefourth fin-type pattern.

The third gate electrode 320, the fourth gate electrode 420, and theconductive pattern 180 may be connected with each other. The third gateelectrode 320, the fourth gate electrode 420, and the conductive pattern180 may be electrically connected with each other.

The upper surface of the third gate electrode 320, the upper surface ofthe fourth gate electrode 420, and the upper surface of the conductivepattern 180 may be located in the same plane, e.g., may be coplanar withone another.

In an implementation, the third gate electrode 320 and the fourth gateelectrode 420 may include, e.g., titanium nitride (TiN), tantalumcarbide (TaC), tantalum nitride (TaN), titanium silicon nitride (TiSiN),tantalum silicon nitride (TaSiN), tantalum titanium nitride (TaTiN),titanium aluminum nitride (TiAlN), tantalum aluminum nitride (TaAlN),tungsten nitride (WN), ruthenium (Ru), titanium aluminum (TiAl),titanium aluminum carbonitride (TiAlC—N), titanium aluminum carbide(TiAlC), titanium carbide (TiC), tantalum carbonitride (TaCN), tungsten(W), aluminum (Al), copper (Cu), cobalt (Co), titanium (Ti), tantalum(Ta), nickel (Ni), platinum (Pt), nickel platinum (Ni—Pt), niobium (Nb),niobium nitride (NbN), niobium carbide (NbC), molybdenum (Mo),molybdenum nitride (MoN), molybdenum carbide (MoC), tungsten carbide(WC), rhodium (Rh), palladium (Pd), iridium (Ir), osmium (Os), silver(Ag), gold (Au), zinc (Zn), vanadium (V), or a combination thereof.

In an implementation, the third gate electrode 320 and the fourth gateelectrode 420 may each include a conductive metal oxide, a conductivemetal oxynitride, and so on, and may include an oxidized form of thematerials described above.

The third gate insulating film 325 may include a portion that extendsalong the first portion 160 a of the insulating line pattern facing thethird gate electrode 320. For example, a portion of the third gateinsulating film 325 may be formed between the third gate electrode 320and the insulating line pattern 160.

A portion of the third gate insulating film 325 may extend between thethird gate electrode 320 and the first portion 160 a of the insulatingline pattern facing each other. The third gate insulating film 325 maybe connected with the conductive pattern liner 185 formed along theprofile of the insulating line pattern 160.

In an implementation, the third gate insulating film 325 may not extendbetween the second portion 160 b of the insulating line pattern and theupper surface of the field insulating film 105. Accordingly, the thirdgate insulating film 325 may define the second portion 162 t of thethird trench in which the third gate electrode 320 is formed.

The fourth gate insulating film 425 may be formed between the fourthfin-type pattern 410 and the fourth gate electrode 420. The fourth gateinsulating film 425 may be formed along a profile of the fourth fin-typepattern 410 protruding upward further than the field insulating film105.

In an implementation, the fourth gate insulating film 425 may be betweenthe fourth gate electrode 420 and the field insulating film 105. Thefourth gate insulating film 425 may be formed along the sidewall and thebottom surface of the third portion 163 t of the third trench.

The fourth gate insulating film 425 may include a portion that extendsalong the sidewall of the first portion 160 a of the insulating linepattern 160 facing the fourth gate electrode 420. For example, a portionof the fourth gate insulating film 425 may be formed between the fourthgate electrode 420 and the first portion 160 a of the insulating linepattern.

A portion of the fourth gate insulating film 425 may extend between thefourth gate electrode 420 and the first portion 160 a of the insulatingline pattern facing each other. The fourth gate insulating film 425 maybe connected with the conductive pattern liner 185 formed along theprofile of the insulating line pattern 160.

In an implementation, the fourth gate insulating film 425 may not extendbetween the second portion 160 b of the insulating line pattern and theupper surface of the field insulating film 105. Accordingly, the fourthgate insulating film 425 may define the third portion 163 t of the thirdtrench in which the fourth gate electrode 420 is formed.

The third gate insulating film 325 and the fourth gate insulating film425 may each include, e.g., silicon oxide, silicon oxynitride, siliconnitride, and/or a high-k dielectric material with a higher dielectricconstant than silicon oxide.

As described above, the conductive pattern liner 185 formed on theinsulating line pattern 160 may be connected with the third gateinsulating film 325, and the fourth gate insulating film 425,respectively. Further, the conductive pattern liner 185, the third gateinsulating film 325 and the fourth gate insulating film 425 may eachinclude a high-k dielectric insulating film.

The conductive pattern liner 185 may be formed when the third gateinsulating film 325 and the fourth gate insulating film 425 are formed.

As such, the conductive pattern liner 185, the third gate insulatingfilm 325, and the fourth gate insulating film 425 may be the high-kdielectric gate insulating films which are formed along the profile ofthe third fin-type pattern 310 and the profile of the fourth fin-typepattern 410, protruding greater than the upper surface of the fieldinsulating film 105, along the profile of the insulating line pattern160, and along the profile of the field insulating film 105.

The first liner 170 may extend on the sidewall of the third gateelectrode 320 and the sidewall of the fourth gate electrode 420.

For example, the third source/drain 340 may be formed on both sides ofthe third gate electrode 320. The third source/drain 340 may be formedby doping impurity in the third fin-type pattern 310.

FIG. 18 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments. FIG. 19 illustrates a sectional view of asemiconductor device according to some exemplary embodiments. Forconvenience of explanation, differences that are not explained abovewith reference to FIGS. 14 to 17 will be mainly explained below.

For reference, FIGS. 18 and 19 are cross sectional views taken on lineD-D of FIG. 14. Further, the cross sectional view related to FIG. 18taken on line A-A of FIG. 14 may be similar to FIG. 7, and the crosssectional view related to FIG. 19 taken on line A-A of FIG. 14 may besimilar to FIG. 11.

Referring to FIG. 18, in the semiconductor device according to someexemplary embodiments, an air gap 155 may be formed between theconductive pattern 180 and the insulating line pattern 160.

The air gap 155 may be formed in a portion defined as the first portion161 t of the third trench.

The air gap 155 may be located on the field insulating film 105 betweenthe third fin-type pattern 310 and the fourth fin-type pattern 410.

Referring to FIG. 19, in the semiconductor device according to someexemplary embodiments, the conductive pattern liner 185 formed on thefirst portion 161 t of the third trench may be in contact with the fieldinsulating film 105.

The insulating line pattern 160 may include a first portion 160 a of theinsulating line pattern protruding upward further than the upper surfaceof the field insulating film 105, and not a second portion 160 b of theinsulating line pattern extending along the upper surface of the fieldinsulating film 105.

In an implementation, the second liner 175 may extend between theinsulating line pattern 160 and the upper surface of the fieldinsulating film 105. For example, the second liner 175 may not include aportion extending along the upper surface of the field insulating film105.

FIG. 20 illustrates a sectional view of a semiconductor device accordingto some exemplary embodiments. For convenience of explanation,differences that are not explained above with reference to FIGS. 14 to17 will be mainly explained below.

For reference, a cross sectional view related with FIG. 20 taken on lineA-A of FIG. 14 may be similar to FIG. 4 or FIG. 6.

Referring to FIG. 20, in the semiconductor device according to someexemplary embodiments, the insulating line pattern 160 may not includethe first portion 160 a of the insulating line pattern protruding fromthe upper surface of the field insulating film 105.

In an implementation, the insulating line pattern 160 may include asecond portion 160 b of the insulating line pattern extending along theupper surface of the field insulating film 105.

On the bottom surface of the first portion 161 t of the third trench,the second liner 175 and the insulating line pattern 160 may be formedin a plate-like shape in a sequential order.

Hereinbelow, a method for fabricating a semiconductor device accordingto some exemplary embodiments will be described with reference to FIGS.4 and 21 to 33.

FIGS. 21 to 33 illustrate sectional view of stages in a method offabrication of a semiconductor device according to some exemplaryembodiments.

Referring to FIGS. 21 and 22, the first fin-type pattern 110 and thesecond fin-type pattern 210 elongated or extending in the firstdirection X may be formed on the substrate 100.

The first fin-type pattern 110 and the second fin-type pattern 210 maybe longitudinally or laterally aligned in the first direction X.

The long side 110 a of the first fin-type pattern 110 and the long side210 a of the second fin-type pattern 210 may extend in the firstdirection X. The short side 110 b of the first fin-type pattern 110 andthe short side 210 b of the second fin-type pattern 210, extending inthe second direction Y, may be facing each other.

The isolating trench T (for isolating the first fin-type pattern 110from the second fin-type pattern 210) may be formed between the firstfin-type pattern 110 and the second fin-type pattern 210.

In an implementation, the upper surface of the first fin-type pattern110 and the upper surface of the second fin-type pattern 210 may beexposed. In an implementation, on the upper surface of the firstfin-type pattern 110 and the upper surface of the second fin-typepattern 210, the remainder of the mask pattern used in the process offorming the first fin-type pattern 110 and the second fin-type pattern210 may remain.

The following description is based on a cross sectional view taken online A-A of FIG. 21.

Referring to FIG. 23, a field insulating film 105, partially coveringthe first fin-type pattern 110 and the second fin-type pattern 210, maybe formed.

The field insulating film 105 may partially fill the isolating trench Tbetween the first fin-type pattern 110 and the second fin-type pattern210.

In an implementation, the process of forming the field insulating film105 (for partially covering the first fin-type pattern 110 and thesecond fin-type pattern 210) may include doping (for the purpose ofadjusting threshold voltage) on the first fin-type pattern 110 and thesecond fin-type pattern 210.

Referring to FIG. 24, using a first mask pattern 2001, an etchingprocess may be performed, thus forming a first dummy gate electrode 120p, a second dummy gate electrode 220 p and a third dummy gate electrode160 p.

The first dummy gate electrode 120 p may extend in the second directionY and may be formed on the first fin-type pattern 110. A first dummygate insulating film 125 p may be formed between the first dummy gateelectrode 120 p and the first fin-type pattern 110.

The second dummy gate electrode 220 p may extend in the second directionY and be formed on the second fin-type pattern 210. The second dummygate insulating film 225 p may be formed between the second dummy gateelectrode 220 p and the second fin-type pattern 210.

The third dummy gate electrode 160 p may extend in the second directionY and may be formed between the first fin-type pattern 110 and thesecond fin-type pattern 210. The third dummy gate electrode 160 p may beformed on the field insulating film 105 between the short side of thefirst fin-type pattern 110 and the short side of the second fin-typepattern 210.

In an implementation, the third dummy gate insulating film 160 i may beformed between the third dummy gate electrode 160 p and the fieldinsulating film 105.

In an implementation, depending on a method used for forming the firstdummy gate insulating film 125 p and the second dummy gate insulatingfilm 225 p, the third dummy gate insulating film 160 i may be omittedbetween the third dummy gate electrode 160 p and the field insulatingfilm 105.

In an implementation, the first to third dummy gate electrodes 120 p,220 p, and 160 p may each include, e.g., polysilicon or amorphoussilicon.

The first spacer 130 may then be formed on the sidewall of the firstdummy gate electrode 120 p, followed by forming of the second spacer 230on the sidewall of the second dummy gate electrode 220 p and the firstliner 170 on the sidewall of the third dummy gate electrode 160 p.

Referring to FIG. 25, a first source/drain 140 may be formed on bothsides of the first dummy gate electrode 120 p, within the first fin-typepattern 110.

A second source/drain 240 may be formed on both sides of the seconddummy gate electrode 220 p, within the second fin-type pattern 210.

As described above with reference to FIG. 6, the first source/drain 140and the second source/drain 240 may each include an epitaxial layer.

An interlayer insulating film 190 may then be formed on the fieldinsulating film 105, covering the first fin-type pattern 110 and thesecond fin-type pattern 210, and the first to third dummy gateelectrodes 120 p, 220 p, and 160 p.

The interlayer insulating film 190 may be planarized until the uppersurfaces of the first to third dummy gate electrodes 120 p, 220 p, and160 p are exposed. As a result, the first mask pattern 2001 may beremoved.

Referring to FIG. 26, a second mask pattern 2002 may be formed, coveringthe upper surface of the first dummy gate electrode 120 p and the uppersurface of the second dummy gate electrode 220 p, while exposing theupper surface of the third dummy gate electrode 160 p.

The second mask pattern 2002 may include an opening that exposes theupper surface of the third dummy gate electrode 160 p.

In an implementation, the upper surface of the third dummy gateelectrode 160 p and the upper surface of the first liner 170 may beexposed by the opening included in the second mask pattern 2002.

Referring to FIG. 27, the third dummy gate electrode 160 p may beremoved, using the second mask pattern 2002. In an implementation, thethird dummy gate insulating film 160 i may also be removed.

The third trench 160 t may be formed in the interlayer insulating film190 by removing the third dummy gate electrode 160 p.

The upper surface of the field insulating film 105 may be exposed byremoving the third dummy gate electrode 160 p.

In an implementation, unlike the illustration in FIG. 27, in a processof removing the third dummy gate electrode 160 p and the third dummygate insulating film 160 i, the interlayer insulating film 190 and/or aportion of the first liner 170 that are not covered by the second maskpattern 2002 may be recessed.

Referring to FIG. 28, a liner film 175 p may be formed along thesidewall and the bottom surface of the third trench 160 t, and along theupper surface of the second mask pattern 2002.

Next, on the liner film 175 p, the insulating line film 160 d may beformed along a profile of the liner film 175 p.

The liner film 175 p may include a material having an etch selectivityto a material included in the first liner 170.

In an implementation, the insulating line film 160 d may include amaterial having an etch selectivity to a material included in the linerfilm 175 p.

In an implementation, as illustrated in FIG. 28, the liner film 175 pmay be a single layer.

Referring to FIG. 29, an insulating line pattern 160 may be formed,extending along a portion of the sidewall and the bottom surface of thethird trench 160 t.

The insulating line pattern 160 may be formed by removing a portion ofthe insulating line film 160 d formed on the sidewall of the thirdtrench 160 t. In the process of removing the insulating line pattern160, the insulating line film 160 d formed on the upper surface of thesecond mask pattern 2002 may be removed.

There may be an etch selectivity between the insulating line film 160 dand the liner film 175 p, and a liner film 175 p at a location where theinsulating line film 160 d has been removed, may remain.

In an implementation, unlike the illustration, during formation of theinsulating line pattern 160, the insulating line film 160 d formed onthe bottom surface of the third trench 160 t may also be removed.

Referring to FIG. 30, the liner film 175 p exposed by the removal of theinsulating line film 160 d may be removed to form a second liner 175.

The second liner 175 may be formed, extending along a portion of thesidewall and the bottom surface of the third trench 160 t.

A sacrificial liner film 181 may then be formed on the insulating linepattern 160. The sacrificial liner film 181 may be formed along theupper surface of the second mask pattern 2002, along the sidewall of thefirst liner 170, and along the insulating line pattern 160.

In an implementation, the sacrificial liner film 181 may include, e.g.,polysilicon or the like.

Referring FIG. 31, a sacrificial film 182 filling the third trench 160 tmay be formed on the sacrificial film 181.

The sacrificial film 182 may fill the third trench 160 t, while coveringthe upper surface of the second mask pattern 2002. The sacrificial film182 may include a sacrificial liner film 181.

In an implementation, the sacrificial film 182 may include, e.g.,silicon, silicon germanium, germanium, silicon oxide, silicon nitride,silicon oxynitride, flowable oxide (FOX), Tonen Silazene (TOSZ), undopedsilica glass (USG), borosilica glass (BSG), phosphosilica glass (PSG),borophosphosilica glass (BPSG), plasma enhanced tetraethyl orthosilicate(PETEOS), fluoride silicate glass (FSG), carbon doped silicon oxide(CDO), xerogel, aerogel, amorphous fluorinated carbon, organo silicateglass (OSG), parylene, bis-benzocyclobutenes (BCB), SiLK, polyimide,porous polymeric material, spin on glass (SOG), spin on hardmask (SOH),or a combination thereof.

Referring FIG. 32, due to a removal of a portion of the sacrificial film182, a sacrificial film 183 filling the third trench 160 t may beformed.

By removing the sacrificial film 182 formed on the upper surface of thesecond mask pattern 2002, a sacrificial pattern 183 may be formed.

During formation of the sacrificial pattern 183, the second mask pattern2002 may also be removed. As a result, the first dummy gate electrode120 p and the second dummy gate electrode 220 p may be exposed.

Referring to FIG. 33, the sacrificial pattern 183, the first dummy gateelectrode 120 p, and the second dummy gate electrode 220 p may beremoved.

In an implementation, the first dummy gate insulating film 125 p and thesecond dummy gate insulating film 225 p may be removed.

By removing the first dummy gate electrode 120 p and the first dummygate insulating film 125 p, a first trench 120 t exposing a portion ofthe first fin-type pattern 110 and being defined by the first spacer 130may be formed.

By removing the second dummy gate electrode 220 p and the second dummygate insulating film 225 p, a second trench 220 t exposing a portion ofthe second fin-type pattern 210 and being defined by the second spacer230 may be formed.

Referring to FIG. 4, the first gate electrode 120 for filling the firsttrench 120 t may be formed on the first fin-type pattern 110, and thesecond gate electrode 220 for filling the second trench 220 t may beformed on the second fin-type pattern 210.

In an implementation, the conductive pattern 180 for filling a portionof the third trench 160 t, e.g., for filling the upper portion 160 ut ofthe third trench, may be formed on the insulating line pattern 160 andthe second liner 175.

Hereinbelow, a method for fabricating a semiconductor device accordingto some exemplary embodiments will be described with reference to FIGS.4, 21 to 29, and 32 to 34.

FIG. 34 illustrates a sectional view of a stage in a method offabricating a semiconductor device according to some exemplaryembodiments. For reference, FIG. 34 may involve a process performedafter FIG. 29.

Referring to FIG. 34, a sacrificial film 182 filling the third trench160 t while covering the upper surface of the second mask pattern 2002may be formed.

In the fabrication method of the semiconductor device according to someexemplary embodiments, before forming the sacrificial film 182, thesacrificial liner film 181 may not be formed along the upper surface ofthe second mask pattern 2002, along the sidewall of the first liner 170,and along the insulating line pattern 160.

Hereinbelow, a method for fabricating a semiconductor device accordingto some exemplary embodiments will be described with reference to FIGS.4, 21 to 27, 35, and 36.

FIGS. 35 and 36 illustrate sectional views of stages in a method forfabricating a semiconductor device according to some exemplaryembodiments. For reference, FIG. 35 may involve a process performedafter FIG. 27.

Referring to FIG. 35, the second mask pattern 2002 on the interlayerinsulating film 190 may be removed.

As a result, the upper surface of the interlayer insulating film 190,the first dummy gate electrode 120 p, and the second dummy gateelectrode 220 p may be exposed.

Referring to FIG. 36, a liner film 175 p may be formed, extending alongthe sidewall and the bottom surface of the third trench 160 t, and alongthe upper surface of the interlayer insulating film 190.

Next, although not illustrated, on the liner film 175 p, the insulatingline film 160 d may be formed along a profile of the liner film 175 p.

FIG. 37 illustrates a block diagram of a system on chip (SoC) includinga semiconductor device according to exemplary embodiments.

Referring to FIG. 37, a SoC system 1000 includes an applicationprocessor 1001 and a dynamic random-access memory (DRAM) 1060.

The application processor 1001 may include a central processing unit(CPU) 1010, a multimedia system 1020, a bus 1030, a memory system 1040and a peripheral circuit 1050.

The CPU 1010 may perform arithmetic operation necessary for driving ofthe SoC system 1000. In some exemplary embodiments, the CPU 1010 may beconfigured on a multi-core environment which includes a plurality ofcores.

The multimedia system 1020 may be used for performing a variety ofmultimedia functions on the SoC system 1000. The multimedia system 1020may include a 3D engine module, a video codec, a display system, acamera system, a post-processor, or the like.

The bus 1030 may be used for exchanging data communication among the CPU1010, the multimedia system 1020, the memory system 1040 and theperipheral circuit 1050. In some exemplary embodiments, the bus 1030 mayhave a multi-layer structure. Specifically, an example of the bus 1030may be a multi-layer advanced high-performance bus (AHB), or amulti-layer advanced eXtensible interface (AXI), although exemplaryembodiments are not limited herein.

The memory system 1040 may provide environments necessary for theapplication processor 1001 to connect to an external memory (e.g., DRAM1060) and perform high-speed operation. In some exemplary embodiments ofthe present disclosure, the memory system 1040 may include a separatecontroller (e.g., DRAM controller) to control an external memory (e.g.,DRAM 1060).

The peripheral circuit 1050 may provide environments necessary for theSoC system 1000 to have a seamless connection to an external device(e.g., main board). Accordingly, the peripheral circuit 1050 may includea variety of interfaces to allow compatible operation with the externaldevice connected to the SoC system 1000.

The DRAM 1060 may function as an operation memory necessary for theoperation of the application processor 1001. In some exemplaryembodiments, the DRAM 1060 may be disposed externally to the applicationprocessor 1001, as illustrated. Specifically, the DRAM 1060 may bepackaged into a package on package (PoP) type with the applicationprocessor 1001.

At least one of the above-mentioned components of the SoC system 1000may include at least one of the semiconductor devices according to theexemplary embodiments explained above.

The embodiments may provide a semiconductor device capable of improvingreliability by enhancing device isolation characteristics, and alsoimproving device performance by enhancing a design suitability.

The embodiments may provide a method for fabricating a semiconductordevice capable of improving reliability by enhancing device isolationcharacteristics, and also improving device performance by enhancing adesign suitability.

Example embodiments have been disclosed herein, and although specificterms are employed, they are used and are to be interpreted in a genericand descriptive sense only and not for purpose of limitation. In someinstances, as would be apparent to one of ordinary skill in the art asof the filing of the present application, features, characteristics,and/or elements described in connection with a particular embodiment maybe used singly or in combination with features, characteristics, and/orelements described in connection with other embodiments unless otherwisespecifically indicated. Accordingly, it will be understood by those ofskill in the art that various changes in form and details may be madewithout departing from the spirit and scope of the present invention asset forth in the following claims.

1.-20. (canceled)
 21. A semiconductor device, comprising: a substrate; afirst fin pattern on the substrate; a second fin pattern on thesubstrate; a first gate electrode on the first fin pattern; a secondgate electrode on the second fin pattern; a field insulating film on thesubstrate, and contacting the first fin pattern and the second finpattern; a conductive structure on the field insulating film, andbetween the first gate electrode and the second gate electrode; a firstspacer on the field insulating film, and contacting a first sidewall ofthe conductive structure; and a second spacer on the field insulatingfilm, and contacting a second sidewall of the conductive structure,wherein a bottom surface of the conductive structure directly contactsthe field insulating film.
 22. The semiconductor device of claim 21,further comprising: a first insulating line pattern between theconductive structure and the first spacer; and a second insulating linepattern between the conductive structure and the second spacer.
 23. Thesemiconductor device of claim 21, wherein no spacer is between thebottom surface of the conductive structure and the field insulatingfilm.
 24. The semiconductor device of claim 21, wherein the bottomsurface of the conductive structure is not higher than a bottom surfaceof the first spacer, and not higher than a bottom surface of the secondspacer.
 25. The semiconductor device of claim 21, wherein the firstspacer is spaced apart from the first fin pattern and the second finpattern, and the second spacer is spaced apart from the first finpattern and the second fin pattern.
 26. The semiconductor device ofclaim 21, wherein the conductive structure includes: a conductivepattern; and a conductive pattern liner on the field insulating film andsurrounding the conductive pattern.
 27. The semiconductor device ofclaim 21, wherein an upper surface of the field insulating film is lowerthan an upper surface of the first fin pattern and is lower than anupper surface of the second fin pattern.
 28. The semiconductor device ofclaim 21, further comprising an interlayer insulating film on the fieldinsulating film, and covering the first fin pattern, the second finpattern, the first gate electrode and the second gate electrode.
 29. Asemiconductor device, comprising: a substrate; a first fin pattern onthe substrate; a second fin pattern on the substrate; a first gateelectrode on the first fin pattern; a second gate electrode on thesecond fin pattern; a field insulating film on the substrate, andcontacting the first fin pattern and the second fin pattern; aconductive structure on the field insulating film, and between the firstgate electrode and the second gate electrode, the conductive structuredirectly contacting the field insulating film; a first spacer on thefield insulating film, and contacting a first sidewall of the conductivestructure; and a second spacer on the field insulating film, andcontacting a second sidewall of the conductive structure, wherein nospacer is between a bottom surface of the conductive structure and thefield insulating film.
 30. The semiconductor device of claim 29, whereinthe bottom surface of the conductive structure directly contacts thefield insulating film.
 31. The semiconductor device of claim 29,wherein: a bottom surface of the first spacer is not lower than thebottom surface of the conductive structure, and a bottom surface of thesecond spacer is not lower than the bottom surface of the conductivestructure.
 32. The semiconductor device of claim 29, wherein theconductive structure includes: a conductive pattern liner on the fieldinsulating film and forming a trench; and a conductive pattern fillingthe trench formed by the conductive pattern liner.
 33. The semiconductordevice of claim 32, wherein the conductive pattern liner includes high-kdielectric insulating film.
 34. The semiconductor device of claim 32,wherein an air gap is formed between the conductive pattern liner andthe conductive pattern.
 35. The semiconductor device of claim 29,further comprising: an interlayer insulating film on the fieldinsulating film, and covering the first fin pattern, the second finpattern, the first gate electrode and the second gate electrode; a firstinsulating line pattern between the conductive structure and the firstspacer; and a second insulating line pattern between the conductivestructure and the second spacer.
 36. A semiconductor device, comprising:a substrate; a first fin pattern on the substrate; a second fin patternon the substrate; a first gate electrode on the first fin pattern; asecond gate electrode on the second fin pattern; a field insulating filmon the substrate, and contacting the first fin pattern and the secondfin pattern; a spacer on the field insulating film, and including asidewall portion and a bottom portion, the bottom portion of the spacerincluding an opening; and a conductive structure on the field insulatingfilm, and at least partially filling the opening of the bottom portionof the spacer, wherein the conductive structure directly contacts thefield insulating film.
 37. The semiconductor device of claim 36, whereinno spacer is between a bottom surface of the conductive structure andthe field insulating film.
 38. The semiconductor device of claim 36,wherein the spacer contacts an outer sidewall of the conductivestructure.
 39. The semiconductor device of claim 36, wherein theconductive structure is between the first gate electrode and the secondgate electrode.
 40. The semiconductor device of claim 36, wherein nospacer is between a bottom surface of the conductive structure and thefield insulating film.
 41. A semiconductor device, comprising: asubstrate; a first fin pattern on the substrate; a second fin pattern onthe substrate; a first gate electrode on the first fin pattern; a secondgate electrode on the second fin pattern; a field insulating film on thesubstrate, and contacting the first fin pattern and the second finpattern; a conductive structure on the field insulating film, andbetween the first gate electrode and the second gate electrode; and aspacer on a sidewall of the conductive structure, wherein a top end ofthe spacer and a bottom end of the spacer is between a top end of theconductive structure and a bottom end of the conductive structure. 42.The semiconductor device of claim 41, wherein the conductive structureincludes: a conductive pattern; and a conductive pattern liner on thefield insulating film and surrounding the conductive pattern.
 43. Thesemiconductor device of claim 41, wherein the bottom end of theconductive structure directly contacts the field insulating film.